By Chuan Seng Tan,Kuan-Neng Chen,Steven J. Koester
Three-dimensional (3D) integration is pointed out as a potential road for non-stop functionality progress in built-in circuits (IC) because the traditional scaling procedure is confronted with unparalleled demanding situations in primary and financial limits. Wafer point 3D IC can take numerous varieties, they usually frequently comprise a stack of a number of thinned IC layers which are vertically bonded and interconnected through via silicon through TSV.
There is an extended string of advantages that it is easy to derive from 3D IC implementation similar to shape issue, density multiplication, greater hold up and gear, better bandwidth, and heterogeneous integration. This e-book offers contributions by way of key researchers during this box, masking motivations, know-how structures, functions, and different layout concerns.
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3D Integration for VLSI Systems by Chuan Seng Tan,Kuan-Neng Chen,Steven J. Koester